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BAT54 Series
Small signal Schottky diodes
Main product characteristics
IF VRRM C (typ) Tj (max) 300 mA 40 V 7 pF 150 C
SOD-323 SOD-123
BAT54ZFILM (Single)
BAT54JFILM (Single)
Features and benefits

Low conduction and reverse losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode
SOT-23 SOD-523
BAT54KFILM (Single)
BAT54FILM (Single) BAT54AFILM (Common anode) BAT54SFILM (Series) BAT54CFILM (Common cathode)
Description
The BAT54 series uses 40 V Schottky barrier diodes packaged in SOD- 23, SOD-323, SOD-523, SOT-23, SOT-323, or SOT-666.
Order codes
Part Number BAT54FILM BAT54SFILM BAT54CFILM BAT54AFILM BAT54WFILM BAT54SWFILM BAT54CWFILM BAT54AWFILM BAT54JFILM BAT54KFILM BAT54-07P6FILM BAT54-09P6FILM BAT54ZFILM Marking D86 D88 D87 D84 D73 D78 D77 D74 86 86 P4 Q4 D72
SOT-666
BAT54WFILM (Single) BAT54CWFILM (Common cathode) BAT54AWFILM (Common anode) BAT54SWFILM (Series)
SOT-323
BAT54-07P6FILM (2 parallel diodes) BAT54-09P6FILM (2 opposite diodes)
Configurations in top view
July 2006
Rev 9
1/13
www.st.com
Characteristics
BAT54 Series
1
Table 1.
Symbol VRRM IF IFSM Tstg Tj TL
Characteristics
Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified)
Parameter Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Storage temperature range Operating junction temperature range Maximum soldering temperature tp = 10 ms Sinusoidal Value 40 300 1 -65 to +150 -40 to +150 260 Unit V mA A C C C
Table 2.
Symbol
Thermal parameters
Parameter SOT-23, SOD-123 Value 500 C/W SOT-323, SOD-323, SOD-523, SOT-666 550 600 Unit
Rth(j-a)
Junction to ambient(1)
1. Epoxy printed circuit board with recommended pad layout
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 100 C VR = 30 V IF = 0.1 mA IF = 1 mA Min. Typ Max. 1 A 100 240 320 400 500 900 mV Unit
VF(2)
Forward voltage drop
Tj = 25 C
IF = 10 mA IF = 30 mA IF = 100 mA
1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %
Table 4.
Symbol C trr
Dynamic characteristics
Parameter Diode capacitance Reverse recovery time Test conditions VR = 1 V, F = 1 MHz IF = 10 mA, IR = 10 mA, Tj = 25 C Irr = 1 mA, RL = 100 Min. Typ 7 Max. 10 5 Unit pF ns
2/13
BAT54 Series
Characteristics
Figure 1.
Average forward power dissipation Figure 2. versus average forward current
0.35
=0.05 =0.2 =0.1 =0.5 =1
Average forward current versus ambient temperature ( = 1)
0.35 0.30 0.25 0.20 0.15 0.10 0.05
P(W)
IF(AV)(A)
0.30 0.25 0.20 0.15
T
0.10 0.05
tp
T
IF(AV)(A)
=tp/T
0.20 0.25 0.30
=tp/T
0 25
tp
T amb (C)
0.00 0.00
0.00
0.05 0.10 0.15 0.35
50
75
100
125
150
Figure 3.
Reverse leakage current versus reverse applied voltage (typical values)
Figure 4.
Reverse leakage current versus junction temperature
1.E+02
IR(A)
Tj=100C
IR[T j] / IR[T j=25C]
1.E+04
VR=3V
1.E+01
1.E+03
1.E+02
1.E+00
Tj=50C
1.E+01
1.E-01
Tj=25C
1.E+00
VR(V)
T j(C)
1.E-01
1.E-02 0
5
10
15
20
25
30
0
25
50
75
100
125
150
Figure 5.
Junction capacitance versus reverse applied voltage (typical values)
F=1MHz VOSC=30mVRMS Tj=25C
Figure 6.
Forward voltage drop versus forward current (typical values)
10
C(pF)
1.E+00
IFM(A)
Tj=100C
1.E-01
1.E-02
Tj=50C Tj=25C
1.E-03
VR(V)
Tj=-40 C
1 1 10 100
1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
VFM(V)
3/13
Characteristics
BAT54 Series
Figure 7.
Thermal resistance junction to ambient versus copper surface under each lead - epoxy FR4 with recommended pad layout, eCU = 35 m (SOD-323)
Epoxy FR4 eCU=35 m
Figure 8.
Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 m (SOD-323)
Single pulse SOD323
600
Rth(j-a) (C/W)
1.E+00
Zth(j-a) /Rth(j-a)
500
1.E-01
400
1.E-02
300
SCU(mm)
Epoxy FR4 SCU=2.25 mm eCU=35 m
tP(s)
200 0 5 10 15 20 25 30 35 40 45 50
1.E-03 1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 9.
Relative variation of thermal impedance junction to ambient versus pulse duration aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23)
Single pulse SOT23
Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 m (SOD-523)
1.E+00
Zth(j-a) /Rth(j-a)
Single pulse SOD523
1.E+00
Zth(j-a) /Rth(j-a)
1.E-01
1.E-01
1.E-02
Alumine substrate 10 x 8 x 0.5 mm
tP(s)
tP(s)
Epoxy FR4 eCU=35 m
1.E-02 1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-03 1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 m (SOT-666)
1.E+00
Zth(j-a) /Rth(j-a)
Single pulse SOT666
1.E-01
tP(s)
Epoxy FR4 eCU=35 m
1.E-02 1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
4/13
BAT54 Series
Ordering information scheme
2
Ordering information scheme
BAT54
Signal Schottky diodes VRRM = 40 V Configuration No letter = Single diode A = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Package Blank = SOT-23 J = SOD-323 W = SOT-323 K = SOD-523 P6 = SOT-666 Z = SOD-123 Packing FILM = Tape and reel
xx
xx FILM
5/13
Package information
BAT54 Series
3
Package information
Epoxy meets UL94, V0 Table 5. SOD-123 dimensions
Dimensions Ref.
H A2 A1 b E
Millimeters Min. Max. 1.45 0 0.85 0.1 1.35 0
Inches Min. Max. 0.057 0.004 0.053
A A1
D
A
A2 b
0.033
0.55 Typ. 0.15 Typ. 2.55 1.4 0.25 3.55 3.95 2.85 1.7
0.022 Typ. 0.039 Typ. 0.1 0.055 0.01 0.14 0.156 0.112 0.067
c
c D E
G
G H
Figure 12. SOD-123 footprint (dimensions in mm)
4.45
0.65
0.97
2.51
0.97
6/13
BAT54 Series Table 6. SOD-323 dimensions
Package information
Dimensions Ref.
H b E A1
Millimeters Min. Max. 1.17 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 0
Inches Min. Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016
A A1
D A
b c
0.01 0.004 0.06 0.044 0.09 0.004 0.004
c
Q1
D E
L
H L Q1
Figure 13. SOD-323 footprint (dimensions in mm)
3.20
0.54
1.06
1.08
1.06
7/13
Package information Table 7. SOD-523 dimensions
Dimensions
E 0.15 M C A B E1 B
BAT54 Series
Ref.
Millimeters Min. Typ. 0.60 1.60 1.20 0.80 Max. 0.70 1.70 1.30 0.90 0.35 0.20 0.20 0.25 0.20 Min. 0.020 0.059 0.043 0.028 0.010 0.003 0.006 0.004
Inches Typ. 0.024 0.063 0.047 0.031 Max. 0.028 0.067 0.051 0.035 0.014 0.008 0.008 0.010 0.008
2xb
D
A E
8
0.50 1.50 1.10 0.70 0.25 0.07 0.15 0.10
0.20 M C A B A R0.1
E1
A
SEATING PLANE
c C L 7
D b c
L1
L L1
Figure 14. SOD-523 footprint (dimensions in mm)
0.7 0.3 2
8/13
BAT54 Series Table 8. SOT-23 dimensions
Package information
Dimensions Ref.
A
E
Millimeters Min. Max. 1.4 0.1 0.51 0.18 3.04 1.05 2.1 1.6 2.75 0.6 typ. 0.35 0.65
Inches Min. 0.035 0 0.012 0.003 0.108 0.033 0.067 0.047 0.083 Max. 0.055 0.004 0.02 0.007 0.12 0.041 0.083 0.063 0.108
A A1
e B e1
D
0.89 0 0.3 0.085 2.75 0.85 1.7 1.2 2.1
B c
S A1
D e e1
L
H
c
E H L S
0.024 typ. 0.014 0.026
Figure 15. SOT-23 footprint (dimensions in mm)
0.95
0.61
1.26
0.73
3.25
9/13
Package information Table 9. SOT-323 dimensions
Dimensions
A
E
BAT54 Series
Ref.
Millimeters Min. Typ. Max. 1.1 0.1 0.4 0.26 2.0 1.25 0.65 1.8 0.1 0 2.1 0.2 2.4 0.3 30 0.071 0.004 0 2.2 1.35 Min. 0.031 0.0 0.010 0.004 0.071 0.045
Inches Typ. Max. 0.043 0.004 0.016 0.010 0.079 0.049 0.026 0.083 0.008 0.094 0.012 30 0.086 0.053
A
e b
D
0.8 0.0 0.25 0.1 1.8 1.15
A1 b c
A1
D E e
c H
L
H L q
Figure 16. SOT-323 footprint (dimensions in mm)
0.95
1.0
2.9
0.8
0.50
10/13
BAT54 Series Table 10. SOT-666 dimensions
Package information
Dimensions
b1 L1
Ref.
Millimeters Min. Typ. Max. Min.
Inches Typ. Max. 0.024 0.007 0.013
L3 b
A A3 b
D E1
0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27
0.60 0.018 0.18 0.003 0.34 0.007
b1 D
0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051
A
E
L2 E A3
E1 e L1 L2
e
L3
Figure 17. SOT-666 footprint (dimensions in mm)
0.50
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
11/13
Ordering information
BAT54 Series
4
Ordering information
Part Number BAT54FILM BAT54SFILM BAT54CFILM BAT54AFILM BAT54WFILM BAT54SWFILM BAT54CWFILM BAT54AWFILM BAT54JFILM BAT54KFILM BAT54-07P6FILM BAT54-09P6FILM BAT54ZFILM Marking D86 D88 D87 D84 D73 D78 D77 D74 86 86 P4 Q4 D72 Package SOT-23 Single SOT-23 Serial SOT-23 Common cathode SOT-23 Common anode SOT-323 Single SOT-323 Serial SOT-323 Common cathode SOT-323 Common anode SOD-323 SOD-523 SOT-666 Parallel SOT-666 Opposite SOD-123 Weight 10 mg 10 mg 10 mg 10 mg 6 mg 6 mg 6 mg 6 mg 5 mg 1.4 mg 2.9 mg 2.9 mg 10 mg Base qty 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 Delivery mode Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel
5
Revision history
Date Jun-1999 24-Jul-2006 Revision 8 9 Last update. BAT54, A, C, S and BAT54J / W / AW / CW /SW datasheets merged. ECOPACK statement added. SOD123, SOD-523 and SOT-666 packages added. Description of Changes
12/13
BAT54 Series
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